Fundamentals of device and systems packaging : (Record no. 171070)

MARC details
000 -LEADER
fixed length control field 02001nam a22002297a 4500
003 - CONTROL NUMBER IDENTIFIER
control field IIITD
005 - DATE AND TIME OF LATEST TRANSACTION
control field 20240116175012.0
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION
fixed length control field 240115b xxu||||| |||| 00| 0 eng d
020 ## - INTERNATIONAL STANDARD BOOK NUMBER
International Standard Book Number 9789390385515
040 ## - CATALOGING SOURCE
Original cataloging agency IIITD
082 ## - DEWEY DECIMAL CLASSIFICATION NUMBER
Classification number 621.381
Item number TUM-F
245 ## - TITLE STATEMENT
Title Fundamentals of device and systems packaging :
Remainder of title technologies and applications
Statement of responsibility, etc edited by Rao R. Tummala
250 ## - EDITION STATEMENT
Edition statement 2nd ed.
260 ## - PUBLICATION, DISTRIBUTION, ETC. (IMPRINT)
Place of publication, distribution, etc Chennai :
Name of publisher, distributor, etc McGraw Hill,
Date of publication, distribution, etc ©2019
300 ## - PHYSICAL DESCRIPTION
Extent 828 p. :
Other physical details ill. ;
Dimensions 25 cm.
501 ## - WITH NOTE
With note Including Index
505 ## - FORMATTED CONTENTS NOTE
Title Part 1 Fundamentals of Packaging <br/>2 Fundamentals of Electrical Design for Signals, Power, and Electromagnetic Interference <br/>3 Fundamentals of Thermal Technologies <br/>4 Fundamentals of Thermo-Mechanical Reliability <br/>5 Fundamentals of Package Materials at Microscale and Nanoscale 6 Fundamentals of Ceramic, Organic, Glass, and Silicon Package Substrates<br/> 7 Fundamentals of Passive Components and Integration with Active Devices <br/>8 Fundamentals of Chip-to-Package Interconnections and Assembly <br/>9 Fundamentals of Embedded and Fan-Out Packaging<br/>10 Fundamentals of 3D Packaging with and without TSV <br/>11 Fundamentals of RF and Millimeter-Wave Packaging <br/>12 Fundamentals of Optoelectronics Packaging <br/>13 Fundamentals of MEMS and Sensor Packaging <br/>14 Fundamentals of Package Encapsulation, Molding, and Sealing 15 Fundamentals of Printed Wiring Boards 16 Fundamentals of Board Assembly
-- Part 2 Applications of Packaging Technologies <br/>17 Applications of Packaging Technologies in Future Car Electronics <br/>18 Applications of Packaging Technologies in Bioelectronics <br/>19 Applications of Packaging Technologies in Communication Systems <br/>20 Applications of Packaging Technologies in Computing Systems 21 Applications of Packaging Technologies in Flexible Electronics 22 Applications of Packaging Technologies in Smartphones Index.
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name as entry element Microelectronic packaging
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name as entry element Electronics engineering
700 ## - ADDED ENTRY--PERSONAL NAME
Personal name Tummala, Rao R.
Relator term editor
942 ## - ADDED ENTRY ELEMENTS (KOHA)
Source of classification or shelving scheme Dewey Decimal Classification
Koha item type Books
Holdings
Withdrawn status Lost status Source of classification or shelving scheme Damaged status Not for loan Collection code Home library Current library Shelving location Date acquired Bill No. Bill Date Cost, normal purchase price PO No. PO Date Total Checkouts Full call number Barcode Date last seen Cost, replacement price Price effective from Vendor/Supplier Koha item type
    Dewey Decimal Classification     Engineering and Allied Operation IIITD IIITD General Stacks 15/01/2024 1165557 2024-01-12 1119.30 IIITD/LIC/BS/2021/04/58 2023-12-21   621.381 TUM-F 012529 15/01/2024 1599 15/01/2024 Atlantic Publishers & Distributors (P) Ltd. Books
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