Fundamentals of device and systems packaging : (Record no. 171070)
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000 -LEADER | |
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fixed length control field | 02001nam a22002297a 4500 |
003 - CONTROL NUMBER IDENTIFIER | |
control field | IIITD |
005 - DATE AND TIME OF LATEST TRANSACTION | |
control field | 20240116175012.0 |
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION | |
fixed length control field | 240115b xxu||||| |||| 00| 0 eng d |
020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
International Standard Book Number | 9789390385515 |
040 ## - CATALOGING SOURCE | |
Original cataloging agency | IIITD |
082 ## - DEWEY DECIMAL CLASSIFICATION NUMBER | |
Classification number | 621.381 |
Item number | TUM-F |
245 ## - TITLE STATEMENT | |
Title | Fundamentals of device and systems packaging : |
Remainder of title | technologies and applications |
Statement of responsibility, etc | edited by Rao R. Tummala |
250 ## - EDITION STATEMENT | |
Edition statement | 2nd ed. |
260 ## - PUBLICATION, DISTRIBUTION, ETC. (IMPRINT) | |
Place of publication, distribution, etc | Chennai : |
Name of publisher, distributor, etc | McGraw Hill, |
Date of publication, distribution, etc | ©2019 |
300 ## - PHYSICAL DESCRIPTION | |
Extent | 828 p. : |
Other physical details | ill. ; |
Dimensions | 25 cm. |
501 ## - WITH NOTE | |
With note | Including Index |
505 ## - FORMATTED CONTENTS NOTE | |
Title | Part 1 Fundamentals of Packaging <br/>2 Fundamentals of Electrical Design for Signals, Power, and Electromagnetic Interference <br/>3 Fundamentals of Thermal Technologies <br/>4 Fundamentals of Thermo-Mechanical Reliability <br/>5 Fundamentals of Package Materials at Microscale and Nanoscale 6 Fundamentals of Ceramic, Organic, Glass, and Silicon Package Substrates<br/> 7 Fundamentals of Passive Components and Integration with Active Devices <br/>8 Fundamentals of Chip-to-Package Interconnections and Assembly <br/>9 Fundamentals of Embedded and Fan-Out Packaging<br/>10 Fundamentals of 3D Packaging with and without TSV <br/>11 Fundamentals of RF and Millimeter-Wave Packaging <br/>12 Fundamentals of Optoelectronics Packaging <br/>13 Fundamentals of MEMS and Sensor Packaging <br/>14 Fundamentals of Package Encapsulation, Molding, and Sealing 15 Fundamentals of Printed Wiring Boards 16 Fundamentals of Board Assembly |
-- | Part 2 Applications of Packaging Technologies <br/>17 Applications of Packaging Technologies in Future Car Electronics <br/>18 Applications of Packaging Technologies in Bioelectronics <br/>19 Applications of Packaging Technologies in Communication Systems <br/>20 Applications of Packaging Technologies in Computing Systems 21 Applications of Packaging Technologies in Flexible Electronics 22 Applications of Packaging Technologies in Smartphones Index. |
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM | |
Topical term or geographic name as entry element | Microelectronic packaging |
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM | |
Topical term or geographic name as entry element | Electronics engineering |
700 ## - ADDED ENTRY--PERSONAL NAME | |
Personal name | Tummala, Rao R. |
Relator term | editor |
942 ## - ADDED ENTRY ELEMENTS (KOHA) | |
Source of classification or shelving scheme | Dewey Decimal Classification |
Koha item type | Books |
Withdrawn status | Lost status | Source of classification or shelving scheme | Damaged status | Not for loan | Collection code | Home library | Current library | Shelving location | Date acquired | Bill No. | Bill Date | Cost, normal purchase price | PO No. | PO Date | Total Checkouts | Full call number | Barcode | Date last seen | Cost, replacement price | Price effective from | Vendor/Supplier | Koha item type |
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Dewey Decimal Classification | Engineering and Allied Operation | IIITD | IIITD | General Stacks | 15/01/2024 | 1165557 | 2024-01-12 | 1119.30 | IIITD/LIC/BS/2021/04/58 | 2023-12-21 | 621.381 TUM-F | 012529 | 15/01/2024 | 1599 | 15/01/2024 | Atlantic Publishers & Distributors (P) Ltd. | Books |