Normal view MARC view ISBD view

Fundamentals of device and systems packaging : technologies and applications edited by Rao R. Tummala - 2nd ed. - Chennai : McGraw Hill, ©2019 - 828 p. : ill. ; 25 cm.

Including Index

Part 1 Fundamentals of Packaging
2 Fundamentals of Electrical Design for Signals, Power, and Electromagnetic Interference
3 Fundamentals of Thermal Technologies
4 Fundamentals of Thermo-Mechanical Reliability
5 Fundamentals of Package Materials at Microscale and Nanoscale 6 Fundamentals of Ceramic, Organic, Glass, and Silicon Package Substrates
7 Fundamentals of Passive Components and Integration with Active Devices
8 Fundamentals of Chip-to-Package Interconnections and Assembly
9 Fundamentals of Embedded and Fan-Out Packaging
10 Fundamentals of 3D Packaging with and without TSV
11 Fundamentals of RF and Millimeter-Wave Packaging
12 Fundamentals of Optoelectronics Packaging
13 Fundamentals of MEMS and Sensor Packaging
14 Fundamentals of Package Encapsulation, Molding, and Sealing 15 Fundamentals of Printed Wiring Boards 16 Fundamentals of Board Assembly Part 2 Applications of Packaging Technologies
17 Applications of Packaging Technologies in Future Car Electronics
18 Applications of Packaging Technologies in Bioelectronics
19 Applications of Packaging Technologies in Communication Systems
20 Applications of Packaging Technologies in Computing Systems 21 Applications of Packaging Technologies in Flexible Electronics 22 Applications of Packaging Technologies in Smartphones Index.

ISBN: 9789390385515

Subjects--Topical Terms:
Microelectronic packaging
Electronics engineering

Dewey Class. No.: 621.381 / TUM-F