Fundamentals of device and systems packaging : technologies and applications

Contributor(s):

Tummala, Rao R [editor]

Material type: Text

9789390385515

Subject(s):

DDC classification:

621.381 TUM-F

Contents:

Part 1 Fundamentals of Packaging 2 Fundamentals of Electrical Design for Signals, Power, and Electromagnetic Interference 3 Fundamentals of Thermal Technologies 4 Fundamentals of Thermo-Mechanical Reliability 5 Fundamentals of Package Materials at Microscale and Nanoscale 6 Fundamentals of Ceramic, Organic, Glass, and Silicon Package Substrates 7 Fundamentals of Passive Components and Integration with Active Devices 8 Fundamentals of Chip-to-Package Interconnections and Assembly 9 Fundamentals of Embedded and Fan-Out Packaging 10 Fundamentals of 3D Packaging with and without TSV 11 Fundamentals of RF and Millimeter-Wave Packaging 12 Fundamentals of Optoelectronics Packaging 13 Fundamentals of MEMS and Sensor Packaging 14 Fundamentals of Package Encapsulation, Molding, and Sealing 15 Fundamentals of Printed Wiring Boards 16 Fundamentals of Board Assembly Part 2 Applications of Packaging Technologies 17 Applications of Packaging Technologies in Future Car Electronics 18 Applications of Packaging Technologies in Bioelectronics 19 Applications of Packaging Technologies in Communication Systems 20 Applications of Packaging Technologies in Computing Systems 21 Applications of Packaging Technologies in Flexible Electronics 22 Applications of Packaging Technologies in Smartphones Index.

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Holdings
Item type	Current library	Collection	Call number	Status	Date due	Barcode	Item holds
Books	IIITD General Stacks	Engineering and Allied Operation	621.381 TUM-F (Browse shelf(Opens below))	Available		012529

Total holds: 0

Including Index

Part 1 Fundamentals of Packaging
2 Fundamentals of Electrical Design for Signals, Power, and Electromagnetic Interference
3 Fundamentals of Thermal Technologies
4 Fundamentals of Thermo-Mechanical Reliability
5 Fundamentals of Package Materials at Microscale and Nanoscale 6 Fundamentals of Ceramic, Organic, Glass, and Silicon Package Substrates
7 Fundamentals of Passive Components and Integration with Active Devices
8 Fundamentals of Chip-to-Package Interconnections and Assembly
9 Fundamentals of Embedded and Fan-Out Packaging
10 Fundamentals of 3D Packaging with and without TSV
11 Fundamentals of RF and Millimeter-Wave Packaging
12 Fundamentals of Optoelectronics Packaging
13 Fundamentals of MEMS and Sensor Packaging
14 Fundamentals of Package Encapsulation, Molding, and Sealing 15 Fundamentals of Printed Wiring Boards 16 Fundamentals of Board Assembly Part 2 Applications of Packaging Technologies
17 Applications of Packaging Technologies in Future Car Electronics
18 Applications of Packaging Technologies in Bioelectronics
19 Applications of Packaging Technologies in Communication Systems
20 Applications of Packaging Technologies in Computing Systems 21 Applications of Packaging Technologies in Flexible Electronics 22 Applications of Packaging Technologies in Smartphones Index.

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